{{Short description|Semiconductor foundry company}} {{Infobox company | name = GlobalFoundries Inc. | logo = GF logo horz rgb R 2025.svg | logo_upright = 1.25 | logo_alt = GlobalFoundries Inc. | type = Public | traded_as = {{ubl|{{NASDAQ|GFS}}|Russell 1000 component}} | ISIN = {{ISIN|sl=n|pl=y|KYG393871085}} | founded = {{Start date and age|2009|03|02}} (as a spin-off of AMD) | location = Malta, New York, U.S. | key_people = {{ubl|Thomas Caulfield (chairman) |Tim Breen (CEO)}} | industry = Semiconductors|| | services = Semiconductor manufacturer | revenue = {{increase}} {{US$|6.791 billion|link=yes}} (2025) | operating_income = {{increase}} {{US$|797 million}} (2025) | net_income = {{increase}} {{US$|888 million}} (2025) | assets = {{increase}} {{US$|17.141 billion}} (2025) | equity = {{increase}} {{US$|11.983 billion}} (2025) | num_employees = 14,000 (2025) | owner = Mubadala (82%) | subsid = | website = {{URL|https://gf.com/}} | font used for the logo = | footnotes = <ref name="AboutUs">{{cite web |url=http://www.globalfoundries.com/about/globalfoundries-fast-facts |title=About Us |website=GlobalFoundries |date=28 September 2016 |access-date=2019-07-04 |archive-date=2015-08-12 |archive-url=https://web.archive.org/web/20150812064357/http://www.globalfoundries.com/about/globalfoundries-fast-facts |url-status=dead }}</ref><ref name=AR24>{{cite web |url=https://www.sec.gov/ix?doc=/Archives/edgar/data/1709048/000170904825000024/gfs-20241231.htm |title=GlobalFoundries Inc. 2024 Annual Report (Form 20-F) |date=20 March 2025 |publisher=U.S. Securities and Exchange Commission |access-date=21 March 2025 }}</ref> }}
'''GlobalFoundries Inc.''' is a multinational semiconductor contract manufacturing and design company domiciled in the Cayman Islands and headquartered in Malta, New York.<ref>"[https://gf.com/press-release/globalfoundries-moves-corporate-headquarters-its-most-advanced-semiconductor GLOBALFOUNDRIES Moves Corporate Headquarters to its Most Advanced Semiconductor Manufacturing Facility in New York] {{Webarchive|url=https://web.archive.org/web/20211110090401/https://gf.com/press-release/globalfoundries-moves-corporate-headquarters-its-most-advanced-semiconductor |date=2021-11-10 }}" April 26, 2021. Retrieved April 26, 2021.</ref> Created by the divestiture of the manufacturing arm of AMD in March 2009, the company was privately owned by Mubadala Investment Company, a sovereign wealth fund of the United Arab Emirates, until an initial public offering (IPO) in October 2021. Mubadala remains the majority owner of the company with an 82% stake.<ref>{{cite news |last=Kwok |first=Karen |date=12 November 2024 |title=Gulf's AI strategy is built on more than sand |url=https://www.reuters.com/breakingviews/gulfs-ai-strategy-is-built-more-than-sand-2024-11-13/ |publisher=Reuters |access-date=23 January 2025 |archive-date=13 November 2024 |archive-url=https://archive.today/20241113123258/https://www.reuters.com/breakingviews/gulfs-ai-strategy-is-built-more-than-sand-2024-11-13/ |url-status=live }}</ref>
The company manufactures integrated circuits on wafers designed for markets such as smart mobile devices, automotive, aerospace and defense, consumer internet of things (IoT) and for data centers and communications infrastructure.
As of 2023, GlobalFoundries is the third-largest semiconductor foundry by revenue.<ref>{{cite web|url=https://www.cnbc.com/2023/10/01/how-globalfoundries-aims-to-remain-worlds-third-biggest-chip-foundry.html|title=How GlobalFoundries aims to remain world's third-biggest chip foundry|date=October 1, 2023|publisher=CNBC|accessdate=October 2, 2023|archive-date=October 2, 2023|archive-url=https://web.archive.org/web/20231002063032/https://www.cnbc.com/2023/10/01/how-globalfoundries-aims-to-remain-worlds-third-biggest-chip-foundry.html|url-status=live}}</ref><ref>{{cite news |last=Sun |first=Leo |url=https://www.fool.com/investing/2021/07/21/intels-interest-in-globalfoundries-could-affect-th/ |title=Intel's Interest in GlobalFoundries Could Affect These 4 Chipmakers |work=The Motley Fool |date=2021-07-21 |access-date=2021-08-16 |archive-date=2023-02-14 |archive-url=https://web.archive.org/web/20230214054912/https://www.fool.com/investing/2021/07/21/intels-interest-in-globalfoundries-could-affect-th/ |url-status=live }}</ref><ref>{{cite web |last1=Leswing |first1=Kif |title=CEO of largest U.S. chip foundry explains why semiconductor shortage could last through 2022 |url=https://www.cnbc.com/2021/04/02/globalfoundries-ceo-on-semiconductor-shortage-and-ipo.html?&qsearchterm=globalfoundries |website=CNBC |language=en |date=2021-04-02 |access-date=2021-05-25 |archive-date=2023-02-26 |archive-url=https://web.archive.org/web/20230226173150/https://www.cnbc.com/2021/04/02/globalfoundries-ceo-on-semiconductor-shortage-and-ipo.html?&qsearchterm=globalfoundries |url-status=live }}</ref> It is the only one with operations in Singapore, the European Union, and the United States: one 200 mm and one 300 mm wafer fabrication plant in Singapore; one 300 mm plant in Dresden, Germany; one 200 mm plant in Essex Junction, Vermont (where it is the largest private employer)<ref name="VT-Largest">{{cite web|url=https://www.sevendaysvt.com/vermont/bottom-line-how-globalfoundries-makes-microchips-during-lockdown/Content?oid=30564372|title=Bottom Line: How GlobalFoundries Makes Microchips During Lockdown|access-date=15 February 2021|archive-date=13 March 2023|archive-url=https://web.archive.org/web/20230313061609/https://www.sevendaysvt.com/vermont/bottom-line-how-globalfoundries-makes-microchips-during-lockdown/Content?oid=30564372|url-status=live}}</ref> and one 300 mm plant in Malta, New York.<ref name="300mm">{{cite web |title=Manufacturing |url=http://globalfoundries.com/manufacturing/manufacturing-overview |url-status=dead |access-date=6 August 2015 |archive-date=5 June 2016 |archive-url=https://web.archive.org/web/20160605144905/http://www.globalfoundries.com/manufacturing/manufacturing-overview }}</ref>
GlobalFoundries is a "Trusted Foundry" for the U.S. federal government and has similar designations in Singapore and Germany, including certified international Common Criteria standard (ISO 15408, CC Version 3.1).<ref>{{cite tweet |author=Julia Chatterley|user=jchatterleyCNN |number=1379463063779282945 |title=Thomas Caulfield, CEO @GLOBALFOUNDRIES on billion $$ investment needed in US semiconductor industry.}}</ref><ref>{{cite web |last1=Shih |first1=Willy |title=GlobalFoundries To Build Secure Chips For Defense Department In Upstate New York |url=https://www.forbes.com/sites/willyshih/2021/02/15/globalfoundries-to-build-secure-chips-for-dod-in-upstate-new-york/?sh=260d2c157265 |website=Forbes |language=en |access-date=2021-05-25 |archive-date=2023-02-26 |archive-url=https://web.archive.org/web/20230226173147/https://www.forbes.com/sites/willyshih/2021/02/15/globalfoundries-to-build-secure-chips-for-dod-in-upstate-new-york/?sh=260d2c157265 |url-status=live }}</ref>
On October 28, 2021, the company sold shares in an IPO on the Nasdaq stock exchange at US$47 each, at the higher end of its targeted price range, and raised about US$2.6 billion.<ref>{{cite news| url = https://www.reuters.com/technology/chipmaker-globalfoundries-prices-ipo-upper-end-raise-26-billion-sources-2021-10-27/#:~:text=O)%20said%20on%20Wednesday%20it,year%20in%20the%20United%20States.| title = Chipmaker GlobalFoundries prices IPO at upper end to raise $2.6 bln| newspaper = Reuters| access-date = 2021-11-09| archive-date = 2023-02-26| archive-url = https://web.archive.org/web/20230226173150/https://www.reuters.com/technology/chipmaker-globalfoundries-prices-ipo-upper-end-raise-26-billion-sources-2021-10-27/#:~:text=O)%20said%20on%20Wednesday%20it,year%20in%20the%20United%20States.| url-status = live}}</ref>
== History == On 7 October 2008, Advanced Micro Devices (AMD) announced it planned to go fabless and spin off its semiconductor manufacturing business into a new company temporarily called The Foundry Company. Mubadala announced its subsidiary Advanced Technology Investment Company (ATIC) agreed to pay $700 million to increase its stake in AMD's semiconductor manufacturing business to 55.6 percent (up from 8.1 percent). Mubadala would invest $314 million for 58 million new shares, increasing its stake in AMD to 19.3 percent, and $1.2 billion of AMD's debt would be transferred to The Foundry Company.<ref>{{Cite web |url=https://www.anandtech.com/show/2635 |title=The Business of Tech: Breaking Up Is Hard to Do – AMD Goes Fabless |last=Smith |first=Ryan |publisher=anandtech.com |access-date=2019-08-29 |archive-date=2023-02-26 |archive-url=https://web.archive.org/web/20230226173150/https://www.anandtech.com/show/2635 |url-status=dead }}</ref> On 8 December 2008, amendments were announced: AMD would own approximately 34.2 percent and ATIC would own approximately 65.8 percent of The Foundry Company.<ref>{{Cite web|url=https://www.mubadala.com/en/news/amd-advanced-technology-investment-company-and-mubadala-amend-transaction-agreements|title=AMD, the Advanced Technology Investment Company and Mubadala amend transaction agreements|date=2008-12-08|publisher=mubadala.com|language=en|access-date=2019-08-29|archive-date=2023-06-02|archive-url=https://web.archive.org/web/20230602022157/https://www.mubadala.com/en/news/amd-advanced-technology-investment-company-and-mubadala-amend-transaction-agreements|url-status=live}}</ref>
On 4 March 2009, GlobalFoundries was officially announced.<ref>{{Cite web |url=https://www.mubadala.com/en/news/press-releases-globalfoundries-worlds-first-global-semiconductor-foundry-company-opens-business |title=GlobalFoundries, World's First Global Semiconductor Foundry Company Opens for Business |date=2009-03-04 |publisher=mubadala.com |language=en |access-date=2019-08-29 |archive-date=2023-05-30 |archive-url=https://web.archive.org/web/20230530120327/https://www.mubadala.com/en/news/press-releases-globalfoundries-worlds-first-global-semiconductor-foundry-company-opens-business |url-status=live }}</ref> On 7 September 2009 ATIC announced it would acquire Chartered Semiconductor, based in Singapore, for S$2.5 billion (US$1.8 billion) and integrate Chartered Semiconductor into GlobalFoundries.<ref>{{Cite web|url=https://pcper.com/2009/09/atic-bids-to-buy-chartered-semiconductor-globalfoundries-smiles-politely/|title=ATIC bids to buy Chartered Semiconductor; GlobalFoundries smiles politely|website=PC Perspective|date=7 September 2009|language=en-US|access-date=2019-08-29|archive-date=2023-06-06|archive-url=https://web.archive.org/web/20230606124232/https://pcper.com/2009/09/atic-bids-to-buy-chartered-semiconductor-globalfoundries-smiles-politely/|url-status=live}}</ref> On 13 January 2010 GlobalFoundries announced it had finalized the integration of Chartered Semiconductor.<ref>{{Cite web| url=http://www.globalfoundries.com/newsroom/2010/20100113.aspx| title=GlobalFoundries Finalizes Integration, Emerges as World's First Truly Global Foundry| date=2010-01-17| publisher=GlobalFoundries| archive-url=https://web.archive.org/web/20100117092713/http://www.globalfoundries.com/newsroom/2010/20100113.aspx|access-date=2019-08-29|archive-date=2010-01-17}}</ref>
On 4 March 2012 AMD announced they divested their final 14 percent stake in the company, which concluded AMD's multi-year plan to divest its manufacturing arm.<ref>{{cite web| url=http://www.anandtech.com/show/5627/globalfoundries-granted-independence-acquires-remaining-stake-from-amd| title=GlobalFoundries Granted Independence, Acquires Remaining Stake from AMD| last=Shimpi| first=Anand Lal| publisher=AnandTech| access-date=8 December 2012| archive-date=15 April 2023| archive-url=https://web.archive.org/web/20230415122751/https://www.anandtech.com/show/5627/globalfoundries-granted-independence-acquires-remaining-stake-from-amd| url-status=dead}}</ref>
On 20 October 2014 IBM announced the sale of its microelectronics business to GlobalFoundries.<ref>{{Cite web| url=https://www.ibm.com/investor/att/pdf/IBM-To-Divest-Microelectronics-Business-To-GlobalFoundries.pdf| title=GlobalFoundries to Acquire IBM's Microelectronics Business| publisher=ibm.com| access-date=2019-09-02| archive-date=2023-04-27| archive-url=https://web.archive.org/web/20230427172056/https://www.ibm.com/investor/att/pdf/IBM-To-Divest-Microelectronics-Business-To-GLOBALFOUNDRIES.pdf| url-status=live}}</ref>
As of 2015 the firm owned ten fabrication plants. Fab 1 is in Dresden, Germany. Fabs 2 through 7 are in Singapore. Fabs 8 through 10 are in the northeast United States. These sites are supported by a global network of R&D, design enablement, and customer support in Singapore, China, Taiwan, Japan, India, the United States, Germany, and the United Kingdom.<ref>{{cite press release | url=http://www.globalfoundries.com/newsroom/2011/20110113.aspx | title=GlobalFoundries Unveils Industry's First 28nm Signoff-Ready Digital Design Flows | date=13 January 2011 | access-date=16 January 2011 | archive-date=14 February 2014 | archive-url=https://web.archive.org/web/20140214011444/http://globalfoundries.com/newsroom/2011/20110113.aspx | url-status=live }}</ref> In February 2017, the company announced a new 300 Fab [Fab 11] in China for growing semiconductor market in China.<ref name="anandtech.com">{{cite press release| url=http://www.anandtech.com/show/11117/globalfoundries-to-expand-capacities-build-a-fab-in-china| title=globalfoundries-to-expand-capacities-build-a-fab-in-china| date=11 February 2017| access-date=4 September 2017| archive-date=26 February 2023| archive-url=https://web.archive.org/web/20230226173150/https://www.anandtech.com/show/11117/globalfoundries-to-expand-capacities-build-a-fab-in-china| url-status=dead}}</ref>
In 2016 GlobalFoundries licensed the 14 nm 14LPP FinFET process from Samsung Electronics. In 2018 GlobalFoundries developed the 12 nm 12LP node based on Samsung's 14 nm 14LPP process.<ref name=":0">{{Cite web |url=https://fuse.wikichip.org/news/1497/vlsi-2018-globalfoundries-12nm-leading-performance-12lp/ |title=VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP |last=Schor |first=David |date=2018-07-22 |publisher=WikiChip Fuse |language=en-US |access-date=2019-05-31 |archive-date=2019-04-07 |archive-url=https://web.archive.org/web/20190407104112/https://fuse.wikichip.org/news/1497/vlsi-2018-globalfoundries-12nm-leading-performance-12lp/ |url-status=live }}</ref>
On 27 August 2018 GlobalFoundries announced it had cancelled their 7LP process due to a strategy shift to focus on specialized processes instead of leading edge performance.<ref>{{Cite web| url=https://www.anandtech.com/show/13277/globalfoundries-stops-all-7nm-development| title=GlobalFoundries Stops All 7nm Development: Opts To Focus on Specialized Processes| last1=Shilov| first1=Anton |last2=Ian | first2=Cutress | publisher=anandtech.com| access-date=2019-08-29| archive-date=2019-10-12| archive-url=https://web.archive.org/web/20191012175428/https://www.anandtech.com/show/13277/globalfoundries-stops-all-7nm-development| url-status=dead}}</ref>
On 29 January 2019 AMD announced an amended wafer supply agreement with GlobalFoundries. AMD now has full flexibility for wafer purchases from any foundry at 7 nm or beyond. AMD and GlobalFoundries agreed to commitments and pricing at 12 nm for 2019 through 2021.<ref>{{Cite web| url=https://www.sec.gov/Archives/edgar/data/2488/000000248819000004/a20190129q418earnings8-k.htm| title=Document| website=sec.gov| access-date=2019-08-29| archive-date=2023-03-31| archive-url=https://web.archive.org/web/20230331054823/https://www.sec.gov/Archives/edgar/data/2488/000000248819000004/a20190129q418earnings8-k.htm| url-status=live}}</ref>
On 20 May 2019 Marvell Technology Group announced it would acquire Avera Semi from GlobalFoundries for $650 million and potentially an additional $90 million. Avera Semi was GlobalFoundries' ASIC Solutions division, which had been a part of IBM's semiconductor manufacturing business.<ref>{{Cite press release|url=https://www.prnewswire.com/news-releases/marvell-to-acquire-avera-semi-creating-an-infrastructure-asic-powerhouse-300853422.html|title=Marvell to Acquire Avera Semi, Creating an Infrastructure ASIC Powerhouse|last=Marvell|publisher=prnewswire.com|language=en|access-date=2019-08-29|archive-date=2019-08-12|archive-url=https://web.archive.org/web/20190812215626/https://www.prnewswire.com/news-releases/marvell-to-acquire-avera-semi-creating-an-infrastructure-asic-powerhouse-300853422.html|url-status=live}}</ref> On 1 February 2019 GlobalFoundries announced the $236 million sale of its Fab 3E in Tampines, Singapore, to Vanguard International Semiconductor (VIS) as part of their plan to exit the MEMS business by 31 December 2019.<ref>{{Cite web| url=https://www.anandtech.com/show/13925/globalfoundries-to-sell-200mm-fab-3e-to-vanguard-to-exit-mems-business| title=GlobalFoundries to Sell 200-mm Fab 3E to Vanguard, Exits MEMS Business| last=Shilov| first=Anton| publisher=anandtech.com| access-date=2019-08-29| archive-date=2019-08-29| archive-url=https://web.archive.org/web/20190829044959/https://www.anandtech.com/show/13925/globalfoundries-to-sell-200mm-fab-3e-to-vanguard-to-exit-mems-business| url-status=dead}}</ref> On April 22, 2019, GlobalFoundries announced the $430 million sale of their Fab 10 in East Fishkill, New York, to ON Semiconductor. GlobalFoundries has received $100 million and was going to receive another $330 million at the end of 2022 when ON Semiconductor would gain full operational control. The 300mm fab is capable of 65 nm to 40 nm and was a part of IBM.<ref>{{Cite web| url=https://www.globalfoundries.com/news-events/press-releases/semiconductor-and-globalfoundries-partner-transfer-ownership-east| title=ON Semiconductor and GlobalFoundries Partner to Transfer Ownership of East Fishkill, NY 300mm Facility| last=eric.millington| date=2019-04-22| website=GlobalFoundries| language=en| access-date=2019-08-29| archive-date=2019-08-29| archive-url=https://web.archive.org/web/20190829044958/https://www.globalfoundries.com/news-events/press-releases/semiconductor-and-globalfoundries-partner-transfer-ownership-east| url-status=live}}</ref> On August 15, 2019, GlobalFoundries announced a multi-year supply agreement with Toppan Photomasks. The agreement included Toppan acquiring GlobalFoundries' Burlington photomask facility.<ref>{{Cite web| url=https://www.globalfoundries.com/news-events/press-releases/toppan-photomasks-and-globalfoundries-enter-multi-year-supply-agreement| title=Toppan Photomasks and GlobalFoundries Enter into Multi-Year Supply Agreement| last=eric.millington| date=2019-08-13| website=GlobalFoundries| language=en| access-date=2019-08-29| archive-date=2019-08-29| archive-url=https://web.archive.org/web/20190829044958/https://www.globalfoundries.com/news-events/press-releases/toppan-photomasks-and-globalfoundries-enter-multi-year-supply-agreement| url-status=live}}</ref>
In February 2020 GlobalFoundries announced that its embedded magnetoresistive non-volatile memory (eMRAM) entered production which is the industry's first production ready eMRAM.<ref>{{Cite web|url=https://www.design-reuse.com/news/47614/globalfoundries-demram-22fdx-iot-automotive.html|title=GlobalFoundries Delivers Industry's First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications|website=Design And Reuse|language=en|access-date=2020-03-12|archive-date=2020-08-01|archive-url=https://web.archive.org/web/20200801025409/https://www.design-reuse.com/news/47614/globalfoundries-demram-22fdx-iot-automotive.html|url-status=live}}</ref>
In May 2020 GlobalFoundries stated it was fully abandoning its plans of opening Fab 11 in Chengdu, China due to reported rivalry between the latter and the US.<ref>{{Cite web|date=2020-05-20|title=Chips are down for China, as American firm shuts semiconductor factory|url=https://www.scmp.com/economy/china-economy/article/3085230/us-semiconductor-giant-shuts-china-factory-hailed-miracle|access-date=2021-06-05|publisher=South China Morning Post|language=en|archive-date=2021-06-05|archive-url=https://web.archive.org/web/20210605181647/https://www.scmp.com/economy/china-economy/article/3085230/us-semiconductor-giant-shuts-china-factory-hailed-miracle|url-status=live}}</ref> This happened three years after the manufacturer announced it would invest $10 billion to open the new fab; however, the fab was never brought online.<ref>{{cite web |last1=Geng |first1=Yvonne |title=GlobalFoundries Abandons Chengdu Wafer Fab |url=https://www.eetimes.com/globalfoundries-abandons-chengdu-wafer-fab/ |website=EE Times |date=26 May 2020 |access-date=1 January 2021 |archive-date=16 December 2020 |archive-url=https://web.archive.org/web/20201216084939/https://www.eetimes.com/globalfoundries-abandons-chengdu-wafer-fab/ |url-status=live }}</ref>
On 26 April 2021 GlobalFoundries announced that effective immediately, it was transferring its global headquarters from Santa Clara, California to its Malta, New York campus (home to Fab 8).<ref name="Rulison">{{cite news |last1=Rulison |first1=Larry |title=GlobalFoundries moving headquarters to Malta |url=https://www.timesunion.com/news/article/Globalfoundries-moving-headquarters-to-Malta-16129166.php |access-date=28 November 2021 |work=Times Union |date=26 April 2021 |archive-date=28 November 2021 |archive-url=https://web.archive.org/web/20211128193400/https://www.timesunion.com/news/article/Globalfoundries-moving-headquarters-to-Malta-16129166.php |url-status=live }}</ref>
In August 2022 Google expanded its open-source chip design and manufacturing efforts by partnering with GlobalFoundries to develop an open-source process design kit (PDK) based on the foundry's 180 nm node.<ref>{{cite web |url=https://www.electronicdesign.com/technologies/analog/article/21248449/electronic-design-globalfoundries-google-push-for-more-opensource-silicon |title=GlobalFoundries, Google Push for More Open-Source Silicon |date=10 August 2022 |publisher=Electronic Design (magazine) |last=Morra |first=James |access-date=25 August 2022 |archive-date=12 August 2022 |archive-url=https://web.archive.org/web/20220812004829/https://www.electronicdesign.com/technologies/analog/article/21248449/electronic-design-globalfoundries-google-push-for-more-opensource-silicon |url-status=live }}</ref><ref>{{cite web |url=https://www.siliconrepublic.com/machines/google-open-source-chip-design-globalfoundries |title=Google expands its open-source chip initiative with new partnership |date=9 August 2022 |publisher=Silicon Republic |last=McGowran |first=Leigh |access-date=25 August 2022 |archive-date=25 August 2022 |archive-url=https://web.archive.org/web/20220825105247/https://www.siliconrepublic.com/machines/google-open-source-chip-design-globalfoundries |url-status=live }}</ref> In October 31, Google announced they would sponsor no-cost OpenMPW (multi-project wafer) shuttle runs for it in the coming months.<ref>{{Cite web |title=Google funds open source silicon manufacturing shuttles for GlobalFoundries PDK |url=https://opensource.googleblog.com/2022/10/announcing-globalfoundries-open-mpw-shuttle-program.html |access-date=2022-11-13 |publisher=Google Open Source Blog |archive-date=2022-11-13 |archive-url=https://web.archive.org/web/20221113090947/https://opensource.googleblog.com/2022/10/announcing-globalfoundries-open-mpw-shuttle-program.html |url-status=live }}</ref>
GlobalFoundries was a gold sponsor for the Special Olympics Vermont Penguin Plunge which raised over $500,000 in 2022 to support Vermont athletes.<ref>{{Cite web |last= |date=2022-03-18 |title=Penguin Plunge Raises Over $500,000 for Special Olympics Vermont |url=https://www.specialolympicsvermont.org/post/penguin-plunge-raises-over-500-000-for-special-olympics-vermont |access-date=2024-07-26 |website=Special Olympics VT |language=en}}</ref>
In February 2023 GlobalFoundries signed a deal to become the exclusive provider of US-produced semiconductor chips for General Motors amid an ongoing shift to electric vehicles in what was referred to as an "industry-first" deal. It would help General Motors reduce the amount of different chips needed in its vehicles. The companies planned for production in Malta, New York. The deal would not lead to new jobs right away but would rather ensure stability in the supply of chips. At the time of the announcement, GlobalFoundries CEO Thomas Caufield said the full effect of this increase in production would be seen in two to three years.<ref>{{Cite web |last=Wayland |first=Michael |title=General Motors signs deal with GlobalFoundries for exclusive U.S. semiconductor production |url=https://www.cnbc.com/2023/02/09/general-motors-globalfoundries-strike-semiconductor-deal.html |access-date=2023-02-10 |website=CNBC |date=9 February 2023 |language=en |archive-date=2023-02-09 |archive-url=https://web.archive.org/web/20230209234749/https://www.cnbc.com/2023/02/09/general-motors-globalfoundries-strike-semiconductor-deal.html |url-status=live }}</ref><ref>{{Cite news |last=Rulison |first=Larry |date=2023-02-09 |title=GlobalFoundries signs deal with GM to provide chips to vehicles |url=https://www.timesunion.com/business/article/globalfoundries-signs-deal-gm-provide-chips-17774231.php |access-date=2023-02-10 |website=Times Union |language=en-US |archive-date=2023-02-10 |archive-url=https://web.archive.org/web/20230210071312/https://www.timesunion.com/business/article/globalfoundries-signs-deal-gm-provide-chips-17774231.php |url-status=live }}</ref><ref>{{Cite news |last=Boudette |first=Neal E. |date=2023-02-09 |title=General Motors Reaches Deal to Ensure Its Chip Supply |language=en-US |work=The New York Times |url=https://www.nytimes.com/2023/02/09/business/energy-environment/general-motors-globalfoundries-chips.html |access-date=2023-02-10 |issn=0362-4331 |archive-date=2023-02-10 |archive-url=https://web.archive.org/web/20230210004732/https://www.nytimes.com/2023/02/09/business/energy-environment/general-motors-globalfoundries-chips.html |url-status=live }}</ref><ref>{{Cite web |author=TOM KRISHER |agency=Associated Press |title=GM reaches computer chip supply deal with upstate NY producer |url=https://www.lockportjournal.com/news/gm-reaches-computer-chip-supply-deal-with-upstate-ny-producer/article_4962b91c-a8a0-11ed-ba94-e38523db9779.html |access-date=2023-02-10 |website=Lockport Union-Sun & Journal |date=9 February 2023 |language=en |archive-date=2023-02-09 |archive-url=https://web.archive.org/web/20230209222054/https://www.lockportjournal.com/news/gm-reaches-computer-chip-supply-deal-with-upstate-ny-producer/article_4962b91c-a8a0-11ed-ba94-e38523db9779.html |url-status=live }}</ref><ref>{{Cite web |last=Valdes-Dapena |first=Peter |date=2023-02-09 |title=GM signs exclusive deal for US semiconductor production |url=https://www.cnn.com/2023/02/09/business/gm-globalfoundries-chip-production/index.html |access-date=2023-02-10 |publisher=CNN |language=en |archive-date=2023-02-10 |archive-url=https://web.archive.org/web/20230210075301/https://www.cnn.com/2023/02/09/business/gm-globalfoundries-chip-production/index.html |url-status=live }}</ref>
On September 21, 2023, the U.S. Department of Defense (DoD) awarded GlobalFoundries a 10-year contract for the supply of securely manufactured semiconductors for critical aerospace and defense applications. With an initial award of $17.3 million and an overall 10-year spending ceiling of $3.1 billion, this agreement ensures the DoD and its contractors have access to GF's U.S.-made semiconductors. This contract also provides access to GF's design ecosystem, IP libraries, and advanced technologies.<ref>{{cite web |title=U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing |date=21 September 2023 |url=https://www.gf.com/news_release/US-DoD-Contract-2023 |publisher=GlobalFoundries |access-date=27 September 2023 }}{{Dead link|date=January 2026 |bot=InternetArchiveBot }}</ref>
In November 2024, GF paid a US$500,000 fine to the United States Department of Commerce for unlicensed shipments of US$17 million in product to a sanctioned entity related to Semiconductor Manufacturing International Corporation.<ref>{{Cite news |last1=Alper |first1=Alexandra |last2=Ward |first2=Jasper |last3=Ljunggren |first3=David |date=November 1, 2024 |title=US fines GlobalFoundries for shipping chips to sanctioned Chinese firm |url=https://www.reuters.com/technology/us-penalizes-globalfoundries-shipping-chips-chinese-firm-2024-11-01/ |access-date=November 1, 2024 |work=Reuters}}</ref><ref>{{Cite news |last=Swanson |first=Ana |date=November 1, 2024 |title=Chipmaker GlobalFoundries Faces $500,000 Fine for Banned Shipments to China |url=https://www.nytimes.com/2024/11/01/us/politics/globalfoundries-chips-fine-china.html |access-date=November 1, 2024 |work=The New York Times}}</ref>
=== Expansion and Investment under the CHIPS and Science Act===
In February 2024, the U.S. Department of Commerce announced a $1.5 billion planned investment in GF as part of the CHIPS and Science Act, making GF the recipient of the first major award from the funding initiative. This investment is set to bolster GF's efforts to expand and introduce new manufacturing capacities, thereby enhancing the production of semiconductors for automotive, IoT, aerospace, defense, and other vital sectors.<ref>{{cite web |url=https://www.commerce.gov/news/press-releases/2024/02/biden-harris-administration-announces-preliminary-terms-globalfoundries |title=Biden-Harris Administration Announces Preliminary Terms with GlobalFoundries to Strengthen Domestic Legacy Chip Supply for U.S. Auto and Defense Industries |date=2024-02-19 |access-date=2024-02-24 |archive-date=2024-02-25 |archive-url=https://web.archive.org/web/20240225083638/https://www.commerce.gov/news/press-releases/2024/02/biden-harris-administration-announces-preliminary-terms-globalfoundries |url-status=live }}</ref>
In May 2026, GlobalFoundaries will receive $375 million to establish a “secure, domestic quantum foundry for leading architectures and multiple modalities."<ref>{{Cite web |last=Somerville |first=Amrith Ramkumar and Heather |date=2026-05-21 |title=Exclusive {{!}} U.S. to Award Quantum-Computing Firms $2 Billion and Take Equity Stakes |url=https://www.wsj.com/tech/quantum-computing-grants-ibm-rigetti-globalfoundries-7382e6be |access-date=2026-05-23 |website=The Wall Street Journal |language=en-US}}</ref><ref>{{Cite journal |last=Fanto |first=Michael L. |date=2021-07-15 |title=Quantum Integrated Photonics Fabrication at the Foundry Level |url=https://doi.org/10.1117/12.2603533 |journal=Photonics for Quantum |publisher=SPIE |pages=40 |doi=10.1117/12.2603533|url-access=subscription }}</ref>
=== ''GlobalFoundries v. TSMC et al'' (2019) === On August 26, 2019, GlobalFoundries filed patent infringement lawsuits against TSMC and some of TSMC's customers<ref>{{Cite web|url=https://wccftech.com/globalfoundries-sues-tsmc-patent-infringement/|title=GlobalFoundries Sues TSMC & 19 Others For Alleged Patent Infringement|first=Ramish|last=Zafar|date=August 26, 2019|access-date=December 19, 2019|archive-date=December 25, 2019|archive-url=https://web.archive.org/web/20191225131440/https://wccftech.com/globalfoundries-sues-tsmc-patent-infringement/|url-status=live}}</ref> in the US and Germany. GlobalFoundries claims TSMC's 7 nm, 10 nm, 12 nm, 16 nm, and 28 nm nodes have infringed on 16 of its patents. Lawsuits were filed in the U.S. International Trade Commission, the U.S. Federal District Courts in the Districts of Delaware, the Western District of Texas, the Regional Courts of Düsseldorf, and Mannheim in Germany.<ref>{{Cite web|url=https://www.globalfoundries.com/news-events/press-releases/globalfoundries-files-patent-infringement-lawsuits-against-tsmc-us-and|title=GlobalFoundries Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany|last=eric.millington|date=2019-08-26|publisher=GlobalFoundries|language=en|access-date=2019-08-28|archive-date=2019-08-28|archive-url=https://web.archive.org/web/20190828062713/https://www.globalfoundries.com/news-events/press-releases/globalfoundries-files-patent-infringement-lawsuits-against-tsmc-us-and|url-status=live}}</ref> GlobalFoundries has named 20 defendants: Apple, Broadcom, MediaTek, Nvidia, Qualcomm, Xilinx, Arista, ASUS, BLU, Cisco, Google, Hisense, Lenovo, Motorola, TCL, OnePlus, Avnet/EBV, Digi-Key and Mouser.<ref>{{Cite web|url=https://www.globalfoundries.com/sites/default/files/media_fact_sheet.pdf| title=Media Fact Sheet| date=Aug 25, 2019| website=GlobalFoundries| access-date=August 28, 2019|archive-date=August 28, 2019|archive-url=https://web.archive.org/web/20190828062714/https://www.globalfoundries.com/sites/default/files/media_fact_sheet.pdf|url-status=dead}}</ref> On August 27, TSMC announced it was reviewing the complaints filed, but are confident that the allegations are baseless and will vigorously defend its proprietary technology.<ref>{{Cite press release|url=https://www.tsmc.com/tsmcdotcom/PRListingNewsAction.do?action=detail&language=E&newsid=THPGSTTHTH|title=TSMC Will Vigorously Defend its Proprietary Technology in Response to GlobalFoundries Complaints|publisher=Taiwan Semiconductor Manufacturing Company Limited|date=27 August 2019 |access-date=2019-08-28|archive-date=2019-08-27|archive-url=https://web.archive.org/web/20190827210152/https://www.tsmc.com/tsmcdotcom/PRListingNewsAction.do?action=detail&language=E&newsid=THPGSTTHTH|url-status=live}}</ref>
On 1 October 2019 TSMC filed patent infringement lawsuits against GlobalFoundries in the US, Germany and Singapore. TSMC claimed GlobalFoundries' 12 nm, 14 nm, 22 nm, 28 nm and 40 nm nodes have infringed on 25 of its patents.<ref>{{Cite press release|url=https://www.tsmc.com/tsmcdotcom/PRListingNewsAction.do?action=detail&newsid=THGOSTTHTH|title=TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide|publisher=Taiwan Semiconductor Manufacturing Company Limited|date=1 October 2019 |access-date=2019-10-02|archive-date=2019-10-02|archive-url=https://web.archive.org/web/20191002040547/https://www.tsmc.com/tsmcdotcom/PRListingNewsAction.do%3Faction%3Ddetail%26newsid%3DTHGOSTTHTH|url-status=live}}</ref>
On 29 October 2019 TSMC and GlobalFoundries announced a resolution to the dispute. The companies agreed to a new life-of-patents cross-license for all of their existing semiconductor patents as well as new patents to be filed by the companies in the next ten years.<ref>{{Cite press release|url=https://www.tsmc.com/tsmcdotcom/PRListingNewsAction.do?action=detail&language=E&newsid=THHKHIPGTH|title=TSMC and GlobalFoundries Announce Resolution of Global Disputes Through Broad Global Patent Cross-License|publisher=Taiwan Semiconductor Manufacturing Company Limited|date=29 October 2019 |access-date=2019-10-29|archive-date=2019-10-29|archive-url=https://web.archive.org/web/20191029014342/https://www.tsmc.com/tsmcdotcom/PRListingNewsAction.do%3Faction%3Ddetail%26language%3DE%26newsid%3DTHHKHIPGTH|url-status=live}}</ref><ref>{{Cite press release|url=https://www.globalfoundries.com/news-events/press-releases/globalfoundries-and-tsmc-announce-resolution-global-disputes-through|title=GlobalFoundries and TSMC Announce Resolution of Global Disputes Through Broad Global Patent Cross-License|date=2019-10-28|publisher=GlobalFoundries|language=en|access-date=2019-10-30|archive-date=2019-10-30|archive-url=https://web.archive.org/web/20191030042449/https://www.globalfoundries.com/news-events/press-releases/globalfoundries-and-tsmc-announce-resolution-global-disputes-through|url-status=live}}</ref><ref>{{cite news|url=https://www.forbes.com/sites/tiriasresearch/2019/09/11/globalfoundries-files-suit-against-tsmc--the-outcome-could-have-broad-consequences/|date=2019-09-11|title=GlobalFoundries Files Suit Against TSMC – The Outcome Could Have Broad Consequences|first=Jim|last=McGregor|website=Forbes|access-date=2019-12-19|archive-date=2019-12-19|archive-url=https://web.archive.org/web/20191219072516/https://www.forbes.com/sites/tiriasresearch/2019/09/11/globalfoundries-files-suit-against-tsmc--the-outcome-could-have-broad-consequences/|url-status=live}}</ref><ref>{{cite news|url=https://www.reuters.com/article/db-tsmc-globalfoundries-lawsuit-test-idUSKBN1WG3B5|title=TSMC counter-sues US chip rival GlobalFoundries for patent infringement|newspaper=Reuters|date=October 2019|via=mobile.reuters.com|access-date=2019-12-19|archive-date=2019-12-19|archive-url=https://web.archive.org/web/20191219072514/https://www.reuters.com/article/db-tsmc-globalfoundries-lawsuit-test-idUSKBN1WG3B5|url-status=live}}</ref><ref>{{Cite web|url=https://www.zdnet.com/article/tsmc-accuses-globalfoundries-of-infringing-25-patents-for-node-processes/|title=TSMC accuses GlobalFoundries of infringing 25 patents for node processes|website=ZDNet|access-date=2019-12-19|archive-date=2019-10-04|archive-url=https://web.archive.org/web/20191004122537/https://www.zdnet.com/google-amp/article/tsmc-accuses-globalfoundries-of-infringing-25-patents-for-node-processes/|url-status=live}}</ref>
===Dresden expansion (2025)=== On October 28, 2025, GlobalFoundries announced plans to invest €1.1 billion in the expansion of its Dresden, Germany manufacturing site (Project SPRINT), with the goal of exceeding one million wafers per year by the end of 2028. The investment, supported by the German federal government and the State of Saxony, is part of the framework of the European Chips Act and aims to strengthen Europe's semiconductor supply-chain resilience.<ref>{{cite press release |title=GlobalFoundries Plans Billion-Euro Investment to Expand Chip Manufacturing in Germany |publisher=GlobalFoundries |date=2025-10-28 |url=https://gf.com/gf-press-release/globalfoundries-plans-billion-euro-investment-to-expand-chip-manufacturing-in-germany/}}</ref>
=== List of GlobalFoundries CEOs ===
* Doug Grose (2009–2011)<ref>{{cite news|url=https://online.wsj.com/article/SB10001424052702304319804576389870140940108.html|title=Top Executives Resign at Globalfoundries|first=Don|last=Clark|newspaper=Wall Street Journal|date=June 17, 2011|via=www.wsj.com|access-date=May 22, 2021|archive-date=March 10, 2013|archive-url=https://web.archive.org/web/20130310040825/http://online.wsj.com/article/SB10001424052702304319804576389870140940108.html|url-status=live}}</ref> * Ajit Manocha (2011–2014) * Sanjay Jha (2014–2018)<ref>{{Cite web|url=https://www.globalfoundries.com/news-events/press-releases/globalfoundries-announces-new-chief-executive-lead-next-phase-growth|title=Homepage | GLOBALFOUNDRIES|date=6 January 2014|access-date=1 December 2020|archive-date=30 October 2020|archive-url=https://web.archive.org/web/20201030084900/https://www.globalfoundries.com/news-events/press-releases/globalfoundries-announces-new-chief-executive-lead-next-phase-growth|url-status=live}}</ref> * Thomas Caulfield (2018–2025)<ref>{{Cite web |url=https://twitter.com/i/events/972196527216168960?lang=en |title=Twitter message |access-date=2020-12-01 |archive-date=2023-01-30 |archive-url=https://web.archive.org/web/20230130051030/https://twitter.com/i/events/972196527216168960?lang=en |url-status=live }}</ref> * Tim Breen (2025–present)<ref>{{Cite web |url=https://gf.com/gf-press-release/globalfoundries-announces-leadership-transition-to-drive-next-phase-of-growth/ |title=GlobalFoundries Announces Leadership Transition to Drive Next Phase of Growth |date=5 February 2025 |access-date=2025-02-06 |archive-date=2025-02-06 |archive-url=https://web.archive.org/web/20250206053016/https://gf.com/gf-press-release/globalfoundries-announces-leadership-transition-to-drive-next-phase-of-growth/ |url-status=live }}</ref>
==Fabrication foundries in operation== {|class="wikitable" !Name !Wafer !Location !Geo Location !Process |- !Fab 1 |300 mm |Dresden, Germany |{{coord|51.125|13.716||name=GlobalFoundries Fab 1, Dresden|display=inline}} | 55, 45, 40, 32, 28, 22 nm, 12 nm |- !Fab 2 |200 mm |Woodlands, Singapore |{{coord|1.436|103.766|region:SG|name=GlobalFoundries Fabs in Woodlands, Singapore|display=inline}} | 600–350 nm |- !Fab 3/5 |200 mm |Woodlands, Singapore |{{coord|1.436|103.766|region:SG|name=GlobalFoundries Fabs in Woodlands, Singapore|display=inline}} | 350–180 nm |- !Fab 3E |200 mm |Tampines, Singapore (2019: sold to VIS) |{{coord|1.371|103.929|region:SG|name=GlobalFoundries Fabs in Tampines, Singapore|display=inline}} | 180 nm |- !Fab 6 |200 mm |Woodlands, Singapore (converted to 300 mm and merged into Fab 7) |{{coord|1.436|103.766|region:SG|name=GlobalFoundries Fabs in Woodlands, Singapore|display=inline}} | 180–110 nm |- !Fab 7 |300 mm |Woodlands, Singapore |{{coord|1.436|103.766|region:SG|name=GlobalFoundries Fabs in Woodlands, Singapore|display=inline}} | 130–40 nm |- !Fab 8 |300 mm |Luther Forest Technology Campus, Saratoga County, New York, United States |{{coord|42.970|-73.756|type:landmark_region:US-NY_source:OpenStreetMap|name=GlobalFoundries Fab 8|display=inline}} | 28, 20, 14 nm |- !Fab 9 |200 mm |Essex Junction, Vermont, United States |{{coord|44.48|-73.10|type:landmark_region:US-VT|name=GlobalFoundries Fab 9|display=inline}}<ref>{{cite news|last1=D'Ambrosio|first1=Dan|title=GlobalFoundries takes over in Essex Junction|url=https://www.burlingtonfreepress.com/story/news/local/2015/07/01/globalfoundries-takes-essex-junction/29564659/|work=Burlington Free Press|date=2015-07-01|language=en|quote=the sprawling manufacturing campus on Robinson Parkway in Essex Junction|access-date=2018-03-15|archive-date=2023-08-06|archive-url=https://web.archive.org/web/20230806165756/https://www.burlingtonfreepress.com/story/news/local/2015/07/01/globalfoundries-takes-essex-junction/29564659/|url-status=live}}</ref> | 350–90 nm |}
===300 mm fabrication facilities=== thumb|GlobalFoundries Fab 1 in Dresden
====Fab 1==== Fab 1, located in Dresden, Germany, is a 364,512 m<sup>2</sup> plant which was transferred to GlobalFoundries on its inception: Fab 36 and Fab 38 were renamed Module 1 and Module 2, respectively. Each module can produce 25,000 300 mm diameter wafers per month.<ref name="300mm" /><ref>{{cite web|url=http://globalfoundries.com/about_us/locations/dresden|title=300mm Manufacturing|access-date=21 May 2023|archive-date=23 July 2012|archive-url=https://web.archive.org/web/20120723112933/http://www.globalfoundries.com/manufacturing/300mm.aspx|url-status=dead}}</ref>
Module 1 is a 300 mm wafer production facility. It is capable of manufacturing wafers at 40 nm, 28 nm BULK and 22 nm FDSOI. Module 2 was originally named "(AMD) Fab 30" and was a 200 mm fab brought online in 1999 and later produced up to 30,000 Wafer Outs Per Month.<ref>https://www.eetimes.com/amd-dedicates-dresden-fab/</ref> It has now been converted into a 300 mm wafer fab.<ref>{{cite web |access-date=2024-04-30 |date=2011-07-13 |title=SA 30596 (N 101/2010) – DE – LIP- GLOBALFOUNDRIES Group (Fab Booster Investment and Fab 1 Annex), Dresden |publisher=europa.eu |url=https://ec.europa.eu/competition/state_aid/cases/235554/235554_1241269_88_2.pdf |archive-date=2024-04-30 |archive-url=https://web.archive.org/web/20240430135430/https://ec.europa.eu/competition/state_aid/cases/235554/235554_1241269_88_2.pdf |url-status=live }}</ref> Together with other clean room extensions like the Annex they have a maximum full capacity of 80,000 of 300 mm wafers/month (180,000 200 mm wafers/month equivalent), using technologies of 45 nm and below.
In September 2016, GlobalFoundries announced Fab 1 would be refit to produce 12 nm fully depleted silicon on insulator (FDSOI) products.<ref>{{cite news|last1=Kampman|first1=Jeff|title=GlobalFoundries adds a 12-nm node to its FD-SOI roadmap|url=https://techreport.com/news/30631/globalfoundries-adds-a-12-nm-node-to-its-fd-soi-roadmap|access-date=16 September 2016|publisher=TechReport|date=8 September 2016|archive-date=25 February 2021|archive-url=https://web.archive.org/web/20210225195716/https://techreport.com/news/30631/globalfoundries-adds-a-12-nm-node-to-its-fd-soi-roadmap/|url-status=live}}</ref> The company expected customer's products would begin to tape out in the first half of 2019.
In 2020 the Dresden plant had a capacity of 300,000 wafers per year.<ref>{{cite web |access-date=2024-04-30 |date=2022-08-15 |title=GlobalFoundries announces mega investment for semiconductor production in Dresden |publisher=investmentmonitor.ai |url=https://www.investmentmonitor.ai/news/globalfoundries-investment-semiconductor-production-dresden/ |archive-date=2024-04-30 |archive-url=https://web.archive.org/web/20240430141349/https://www.investmentmonitor.ai/news/globalfoundries-investment-semiconductor-production-dresden/ |url-status=live }}</ref>
In 2023, it was announced that GlobalFoundries plans to invest $8 billion in its Dresden facility, doubling the capacity of its largest production site.<ref>{{Cite web |last=Cantrill |first=Aggi |date=September 28, 2023 |title=GlobalFoundries to Invest $8 Billion in Dresden Fab, HB Says |url=https://www.bloomberg.com/news/articles/2023-09-28/globalfoundries-to-invest-8-billion-in-dresden-plant-hb-says |website=Bloomberg.com |access-date=2024-02-09 |archive-date=2023-09-28 |archive-url=https://web.archive.org/web/20230928150024/https://www.bloomberg.com/news/articles/2023-09-28/globalfoundries-to-invest-8-billion-in-dresden-plant-hb-says |url-status=live }}</ref>
====Fab 7==== Fab 7, located in Woodlands, Singapore, is an operational 300 mm Fab, originally owned by Chartered Semiconductor. It produces wafers at 130 nm to 40 nm on bulk CMOS and SOI processes. It has a maximum full capacity of 50,000 300 mm wafers/month (112,500 200 mm wafers/month equivalent).<ref>{{cite web |access-date=2024-04-30 |date=2010-01-14 |title=AMD's GlobalFoundries consumes Chartered Semi rival |publisher=theregister.com |url=https://www.theregister.com/2010/01/14/globalfoundries_chartered_combo/ |archive-date=2024-04-30 |archive-url=https://web.archive.org/web/20240430143332/https://www.theregister.com/2010/01/14/globalfoundries_chartered_combo/ |url-status=live }}</ref>
4/15/2021 Fab 7's target capacity will be expanded to 70–80kpcs/M.
====Fab 8==== Fab 8, located in Luther Forest Technology Campus, Saratoga County, New York, United States is a 300 mm fab. This fabrication plant was constructed by GF as a green field fab for advanced technologies. It is capable of manufacturing 14 nm node technology. The plant's construction began in July 2009 and the company started mass production in 2012.<ref name="300mm" /><ref>{{Cite web|url=https://www.globalfoundries.com/about-us|archive-url=https://web.archive.org/web/20090310155833/http://globalfoundries.com/about_us/locations/saratoga_county|url-status=dead|title=About Us|date=September 28, 2016|archive-date=March 10, 2009|website=GlobalFoundries}}</ref> It has a maximum manufacturing capacity of 60,000 of 300 mm wafers/month, or the equivalent of over 135,000 of 200 mm wafers/month. In September 2016, GlobalFoundries announced it would make a multibillion-dollar investment to refit Fab 8 to produce 7 nm FinFET parts starting in the second half of 2018.<ref>{{cite news|last1=Shilov|first1=Anton|title=GlobalFoundries Updates Roadmap|url=http://www.anandtech.com/show/10704/globalfoundries-updates-roadmap-7-nm-in-2h-2018|access-date=3 October 2016|publisher=Anandtech|date=3 October 2016|archive-date=13 January 2021|archive-url=https://web.archive.org/web/20210113103934/https://www.anandtech.com/show/10704/globalfoundries-updates-roadmap-7-nm-in-2h-2018|url-status=dead}}</ref> The process was planned to initially use deep ultraviolet lithography, and eventually transition to extreme ultraviolet lithography.<ref>{{cite news|last1=Kampman|first1=Jeff|title=GlobalFoundries skips the 10-nm node on the way to 7-nm FinFETs|url=https://techreport.com/news/30659/globalfoundries-skips-the-10-nm-node-on-the-way-to-7-nm-finfets|access-date=16 September 2016|publisher=TechReport|date=15 September 2016|archive-date=2 March 2021|archive-url=https://web.archive.org/web/20210302005434/https://techreport.com/news/30659/globalfoundries-skips-the-10-nm-node-on-the-way-to-7-nm-finfets/|url-status=live}}</ref>
However, in August 2018, GlobalFoundries made the decision to suspend 7 nm development and planned production, citing the unaffordable costs to outfit Fab 8 for 7 nm production. GlobalFoundries held open the possibility of resuming 7 nm operations in the future if additional resources could be secured. From this decision GlobalFoundries executed a shift in company strategy to focus more effort on FD-SOI manufacturing and R&D. Fab 8 serves a crucial function to supply AMD (Advanced Micro Devices) with CPU wafers for its Zen-based Ryzen, Threadripper and Epyc lines of CPUs. The original Zen and the Zen+ CPUs are of a monolithic design which were produced at GlobalFoundries facilities in Malta, NY. Going forward, AMD pursued a chiplet design with the Zen 2 series. Zen 2 desktop and server processors consist of a 14/12 nm manufactured I/O die surrounded by a number of 7 nm core dies. When GlobalFoundries announced the suspension of 7 nm operations, AMD executed a shift in plans transferring production of the 7 nm core dies to TSMC (Taiwan Semiconductor Manufacturing Company). There was speculation in some quarters as to where manufacture of the core dies would take place. In AMD's 2018 fourth quarter financial conference call which took place on January 29, 2019, AMD CEO Lisa Su announced the WSA (Wafer Supply Agreement) governing production and acquisition by AMD from GlobalFoundries had been amended for the seventh time. The amendment stated AMD would continue to procure 12 nm node and above from GlobalFoundries while giving AMD latitude to purchase 7 nm node manufactured wafers from any source free from paying any royalties. The agreement will run through 2024 and ensures that GlobalFoundries will have work for its Malta plant for that time period. Pricing commitments for wafers run through 2021 when it is likely the WSA will be amended again.<ref>{{cite web |title=GlobalFoundries Stops All 7nm Development |url=https://www.anandtech.com/show/13277/globalfoundries-stops-all-7nm-development |website=AnandTech |access-date=28 August 2018 |archive-date=12 October 2019 |archive-url=https://web.archive.org/web/20191012175428/https://www.anandtech.com/show/13277/globalfoundries-stops-all-7nm-development |url-status=dead }}</ref>{{Update inline|date=May 2024}}
==== Accreditation as a Trusted Supplier ====
In May 2023, the U.S. Department of Defense (DoD), through the Defense Microelectronics Activity (DMEA), Trusted Access Program Office (TAPO), accredited GlobalFoundries' advanced manufacturing facility in Malta, New York, as a Category 1A Trusted Supplier. This accreditation enables GlobalFoundries to manufacture secure semiconductors for a wide range of critical aerospace and defense applications.<ref>{{Cite web |url=https://gf.com/gf-press-release/u-s-government-accredits-globalfoundries-to-manufacture-trusted-semiconductors-at-new-york-facility/ |title=U.S. Government Accredits GlobalFoundries to Manufacture Trusted Semiconductors at New York Facility |date=30 May 2023 |access-date=2023-05-30 |archive-date=2023-05-30 |archive-url=https://web.archive.org/web/20230530201953/https://gf.com/gf-press-release/u-s-government-accredits-globalfoundries-to-manufacture-trusted-semiconductors-at-new-york-facility/ |url-status=live }}</ref>
====Fab 10==== Fab 10,<ref name="globalfoundries.com">{{cite web|url=http://globalfoundries.com/about/jim-doyle|title=Jim Doyle|access-date=6 August 2015|archive-date=27 January 2016|archive-url=https://web.archive.org/web/20160127080013/http://globalfoundries.com/about/jim-doyle|url-status=dead}}</ref> located in East Fishkill, New York, United States, was previously known as IBM Building 323. It became part of GlobalFoundries operations with the acquisition of IBM Microelectronics. It currently manufactures technology down to the 14 nm node. In April 2019, it was announced that this fab has been sold to ON Semiconductor for $430m. The facility will be transferred over within three years.<ref name="OnSemi">{{cite web|url=https://www.onsemi.com/PowerSolutions/newsItem.do?article=4318|title=ON Semiconductor and GlobalFoundries Partner to Transfer Ownership of East Fishkill, NY 300mm Facility|access-date=24 April 2019|archive-date=22 December 2019|archive-url=https://web.archive.org/web/20191222195403/https://www.onsemi.com/PowerSolutions/newsItem.do?article=4318|url-status=live}}</ref>
On February 10, 2023, Onsemi successfully completed its acquisition of GF's 300 mm East Fishkill, New York site and fabrication facility.<ref>{{Cite web |url=https://www.onsemi.com/company/news-media/press-announcements/en/onsemi-commemorates-transfer-of-ownership-of-east-fishkill-new-york-facility-from-globalfoundries-with-ribbon-cutting-ceremony |title=onsemi Commemorates Transfer of Ownership of East Fishkill, New York Facility from GlobalFoundries with Ribbon Cutting Ceremony |access-date=2023-05-31 |archive-date=2023-05-31 |archive-url=https://web.archive.org/web/20230531171229/https://www.onsemi.com/company/news-media/press-announcements/en/onsemi-commemorates-transfer-of-ownership-of-east-fishkill-new-york-facility-from-globalfoundries-with-ribbon-cutting-ceremony |url-status=live }}</ref>
===200 mm fabrication facilities=== All 200 mm fabs except Fab 9 are located in Singapore, and originally owned by Chartered Semiconductor.
====Fab 2==== Fab 2, located in Woodlands, Singapore. This fab is capable of manufacturing wafers at 600 to 350 nm for use in selected automotive IC products, High Voltage power management IC and Mixed-signal products.
====Fab 3/5==== Fab 3/5, located in Woodlands, Singapore. This fab is capable of manufacturing wafers at 350 to 180 nm for use in high voltage IC's for small panel display drivers and mobile power management modules.
====Fab 3E==== Fab 3E, located in Tampines, Singapore. This fab produces 180 nm wafers for use in selected automotive IC products, High Voltage power management IC and Mixed-Signal products with embedded non-volatile memory technology.
In January 2019 GlobalFoundries announced that it had agreed to sell its Fab 3E in Singapore to Vanguard International Semiconductor Corporation with transfer of ownership set to be completed on December 31, 2019.
====Fab 6==== Fab 6 located in Woodlands, Singapore, is a copper fabrication facility that is capable of manufacturing integrated CMOS and RFCMOS products for applications such as Wi-Fi & Bluetooth devices at 180 to 110 nm processes. The facility was later converted to 300mm and merged with Fab 7, a facility for manufacturing products based on 300mm wafer technology.<ref>{{Cite web |title=GLOBALFOUNDRIES Brief History |url=https://anysilicon.com/globalfoundries-brief-history/ |url-status=live |archive-url=https://web.archive.org/web/20231101000000/https://anysilicon.com/globalfoundries-brief-history/ |archive-date=2023-11-01 |access-date=2025-11-20 |website=AnySilicon |publisher=AnySilicon |language=en}}</ref>
====Fab 9==== Fab 9,<ref name="globalfoundries.com"/> located in the city of Essex Junction, Vermont, United States, near Vermont's largest city of Burlington, became part of GlobalFoundries operations with the acquisition of IBM Microelectronics. The fab manufactures technologies down to the 90 nm node and is the largest private employer within the state of Vermont. The site also hosted a captive mask shop, with development efforts down to the 7 nanometer node, until it was sold to Toppan in 2019.<ref>{{Cite web|url=https://www.anandtech.com/show/14740/globalfoundries-sells-off-photomask-assets-to-toppan|title=GlobalFoundries Sells Off Photomask Assets to Toppan|first=Anton|last=Shilov|date=August 15, 2019|access-date=April 2, 2020|archive-date=March 16, 2020|archive-url=https://web.archive.org/web/20200316175357/https://www.anandtech.com/show/14740/globalfoundries-sells-off-photomask-assets-to-toppan|url-status=dead}}</ref>
==Mergers and acquisitions==
===Chartered Semiconductor=== The majority investor of GlobalFoundries, Abu Dhabi's Advanced Technology Investment Co., announced on September 6, 2009, that it has agreed to acquire Singapore-based Chartered Semiconductor Manufacturing Co. Ltd., for a total of $3.9 billion, with Chartered's operations being folded into GlobalFoundries.<ref>Bolaji Ojo, EE Times. "[http://www.eetimes.com/document.asp?doc_id=1171644 ATIC to buy, fold Chartered into GlobalFoundries] {{Webarchive|url=https://web.archive.org/web/20150924005709/http://www.eetimes.com/document.asp?doc_id=1171644 |date=2015-09-24 }}." September 7, 2009. Retrieved August 10, 2015.</ref>
Chartered Semiconductor is a member of the Common Platform, IBM's semiconductor technology alliance. GlobalFoundries is a JDA partner of Common Platform Technology Alliance.
===IBM Microelectronics=== {{Further information|IBM Microelectronics#2015 sale to GlobalFoundries}} In October 2014, GlobalFoundries received US$1.5 billion from IBM to accept taking over IBM Microelectronics, including a 200 mm fab (now Fab 9) in Essex Junction, Vermont, and a 300 mm fab (now Fab 10) in East Fishkill, New York. As part of the agreement, GlobalFoundries was to have been the sole provider of IBM's server processor chips for the next 10 years. The deal closed on July 1, 2015.<ref>By Alex Barinka and Alan King, Bloomberg. "[https://www.bloomberg.com/news/articles/2014-10-19/ibm-agrees-to-pay-globalfoundries-1-5-billion-to-take-chip-unit IBM to Pay GlobalFoundries $1.5 Billion to Take Chip Unit] {{Webarchive|url=https://web.archive.org/web/20170425212814/https://www.bloomberg.com/news/articles/2014-10-19/ibm-agrees-to-pay-globalfoundries-1-5-billion-to-take-chip-unit |date=2017-04-25 }}." October 20, 2014. Retrieved August 10, 2015.</ref> IBM-India employees who moved over to GlobalFoundries as part of the acquisition are now part of its Bangalore office.<ref>{{cite news|url=https://www.globalfoundries.com/about-us/contact-us/worldwide-locations|title=Worldwide Locations|date=2016-10-28|work=GlobalFoundries|access-date=2017-09-19|language=en|archive-date=2017-09-28|archive-url=https://web.archive.org/web/20170928005458/https://www.globalfoundries.com/about-us/contact-us/worldwide-locations|url-status=live}}</ref>
In April 2019 ON Semiconductor and GlobalFoundries announced a $430 million agreement to transfer ownership of GlobalFoundries 300mm Fab 10 in East Fishkill, New York, to ON Semiconductor.<ref>{{Cite web|url=https://www.forbes.com/sites/patrickmoorhead/2019/05/15/on-semiconductor-and-globalfoundries-both-win-with-its-430m-fab-10-deal/|title=ON Semiconductor And GlobalFoundries Both Win With Its $430M Fab 10 Deal|first=Patrick|last=Moorhead|website=Forbes|access-date=2019-09-25|archive-date=2019-06-06|archive-url=https://web.archive.org/web/20190606234815/https://www.forbes.com/sites/patrickmoorhead/2019/05/15/on-semiconductor-and-globalfoundries-both-win-with-its-430m-fab-10-deal/|url-status=live}}</ref>
In 2021 and 2023, GlobalFoundries sued IBM over intellectual property disputes involving IBM's agreements with Intel and Rapidus.<ref>{{Cite web |title=GlobalFoundries sues IBM, says trade secrets were unlawfully given to Japan's Rapidus |url=https://www.cnbc.com/2023/04/20/globalfoundries-sues-ibm-says-unlawfully-gave-rapidus-trade-secrets.html |date=2023-04-20 |website=CNBC |language=en |access-date=2023-04-26 |archive-date=2023-04-26 |archive-url=https://web.archive.org/web/20230426204142/https://www.cnbc.com/2023/04/20/globalfoundries-sues-ibm-says-unlawfully-gave-rapidus-trade-secrets.html |url-status=live }}</ref>
===Tagore Technology=== On July 1, 2024, GlobalFoundries acquired Tagore Technology's proprietary and production-proven Gallium Nitride (GaN) IP portfolio.<ref>{{cite press release |title=GlobalFoundries Acquires Tagore Technology's GaN Technology to Accelerate Disruptive Power Management Solutions |publisher=GlobalFoundries |date=2024-07-01 |url=https://gf.com/gf-press-release/globalfoundries-acquires-tagore-technologys-gan-technology-to-accelerate-disruptive-powermanagement-solutions/}}</ref> The acquisition expanded GF's power-management solutions roadmap and broadened its access to market-leading GaN IP for high-efficiency power-delivery systems in AI datacenters, automotive and IoT applications.
===MIPS Technologies=== {{main|MIPS Technologies}} In 2025, GlobalFoundries acquired MIPS Technologies, a developer of RISC-V and AI processor IP.<ref>{{cite news |title=GlobalFoundries to Make RISC-V CPUs, Acquires MIPS |url=https://www.tomshardware.com/pc-components/cpus/globalfoundries-to-make-risc-v-cpus-fab-acquires-mips-will-integrate-risc-v-and-ai-ip-into-its-portfolio |work=Tom's Hardware |date=2025}}</ref> The acquisition expanded GF's compute-IP portfolio and supported integration of low-power processor architectures into its differentiated technologies.
===GlobalFoundries-TSMC GaN Technology License=== On November 10, 2025, GlobalFoundries entered into a technology-licensing agreement with TSMC covering 650 V and 80 V GaN technology.<ref>{{cite press release |title=GlobalFoundries Licenses GaN Technology from TSMC to Accelerate U.S.-Manufactured Power Portfolio for Datacenter, Industrial and Automotive Customers |publisher=GlobalFoundries |date=2025-11-10 |url=https://gf.com/gf-press-release/globalfoundries-licenses-gan-technology-from-tsmc-to-accelerate-u-s-manufactured-power-portfolio-for-datacenter-industrial-and-automotive-custo/}}</ref> The deal supports GF's development of a U.S.-based GaN power portfolio targeting high-efficiency devices for data-center, industrial, and automotive applications.
===Advanced Micro Foundry===
On November 17, 2025, GlobalFoundries announced its acquisition of Advanced Micro Foundry (AMF), a silicon-photonics foundry based in Singapore.<ref>{{cite press release |title=GlobalFoundries Acquires Advanced Micro Foundry |publisher=GlobalFoundries |date=2025-11-17 |url=https://gf.com/gf-press-release/globalfoundries-acquires-advanced-micro-foundry-accelerating-silicon-photonics-global-leadership-and-expanding-ai-infrastructure-portfolio}}</ref><ref>{{cite news |title=GlobalFoundries buys Singapore's Advanced Micro Foundry to speed up AI data connections |url=https://www.reuters.com/world/asia-pacific/globalfoundries-buys-singapores-advanced-micro-foundry-push-speed-up-ai-data-2025-11-18/ |publisher=Reuters |date=2025-11-18}}</ref> The acquisition strengthened GF's capabilities in silicon photonics and optical-interconnect manufacturing for data-center, telecom, sensing, and LiDAR markets. The acquisition established the company as the largest silicon photonics pure-play foundry by revenue.
===InfiniLink===
On November 25, 2025, GlobalFoundries acquired InfiniLink, a Cairo-based semiconductor startup focused on high-speed optical-connectivity solutions.<ref>{{cite press release |title=GlobalFoundries Acquires InfiniLink to Power the AI Datacenter Revolution |publisher=GlobalFoundries |date=2025-11-25 |url=https://gf.com/blog/light-speed-ambition-globalfoundries-acquires-amf-and-infinilink-to-power-the-ai-datacenter-revolution}}</ref> The acquisition is intended to accelerate GF's development of pluggable transceivers, co-packaged optics (CPO), and optical components for AI-datacenter and high-performance networking infrastructure.
=== Synopsys’ ARC Processor IP Solutions business === In January 2026, it was announced that GlobalFoundries had agreed to acquire Synopsys’ ARC Processor IP Solutions business. The transaction, expected to close in the second half of 2026 subject to regulatory approvals, includes multiple processor and AI-related IP product lines and associated engineering teams, which are to be integrated into GlobalFoundries' subsidiary, MIPS. Financial terms were not disclosed.<ref>{{Cite web |last=Evertiq |date=2026-01-14 |title=GlobalFoundries to acquire Synopsys' processor IP business |url=https://evertiq.com/design/2026-01-14-globalfoundries-to-acquire-synopsys-processor-ip-business |access-date=2026-01-14 |website=evertiq.com |language=en}}</ref>
==Process technologies== GlobalFoundries' 22 nm FD-SOI process is second-sourced from STMicroelectronics.<ref name="st22fdsoi">STMicroelectronics Secures Additional Sourcing for its Leading-Edge 28nm and 20nm FD-SOI Technology with GLOBALFOUNDRIES "[https://www.st.com/content/st_com/en/about/media-center/press-item.html/stmicroelectronics-secures-additional-sourcing-for-its-leading-edge-28nm-and-20nm-fd-soi-technology-with-globalfoundries.html] {{Webarchive|url=https://web.archive.org/web/20230226174655/https://www.st.com/content/st_com/en/about/media-center/press-item.html/stmicroelectronics-secures-additional-sourcing-for-its-leading-edge-28nm-and-20nm-fd-soi-technology-with-globalfoundries.html|date=2023-02-26}}". Retrieved October 26, 2020.</ref> STMicroelectronics signed a sourcing and licensing agreement with Samsung for the same technology later.<ref name="ss28fdsoi"/>
GlobalFoundries' 14 nm 14LPP FinFET process is second-sourced from Samsung Electronics. GlobalFoundries' 12 nm FinFET nodes are based on Samsung's 14{{nbsp}}nm 14LPP process.<ref name=":0"/>
{{Incomplete list|date=October 2020}}
{| class="wikitable sortable" id="gfprocs" ! Node name !! ITRS<br />node<br />(nm) !! Date<br />introduced !! Wafer size<br />(mm) !! Lithography<br />(wavelength) !! Transistor<br />type !! Gate<br />pitch<br />(nm) !! Metal 1<br />pitch<br />(nm) !! SRAM<br />bit density<br />(μm<sup>2</sup>) |- | 4S || 600 || 1993 || 200 Bulk || – || Planar || – || – || – |- | CS-24 || 500|| 1993 || 200 Bulk || – || Planar || – || – || – |- | 5L || 500|| 1993 || 200 Bulk || – || Planar || – || – || – |- | 5S || 500|| 1994 || 200 Bulk || – || Planar || – || – || – |- | SiGe 5HP || 500|| 2001 || 200 || – || Planar || – || – || – |- | SiGe 5AM || 500|| 2001 || 200 || – || Planar || – || – || – |- | SiGe 5DM || 500|| 2002 || 200 || – || Planar || – || – || – |- | SiGe 5PA || 500|| 2002 || 200 || – || Planar || – || – || – |- | 5X || 450|| 1994 || 200 Bulk || – || Planar || – || – || – |- | CS-34 || 350 || 1995 || 200 Bulk || – || Planar || – || – || – |- | SiGe 5HPE || 350 || 2001 || 200 || – || Planar || – || – || – |- | SiGe 5PAe<ref name="gfsigepa">GlobalFoundries SiGe PA Technologies "[https://www.globalfoundries.com/technologies/rf-soi-and-sige-technologies/sige-pa-technologies] {{Webarchive|url=https://web.archive.org/web/20201030042315/https://www.globalfoundries.com/technologies/rf-soi-and-sige-technologies/sige-pa-technologies|date=2020-10-30}}". Retrieved October 26, 2020.</ref>|| 350 || 2007 || 200 || – || Planar || – || – || – |- | SiGe 5PAx<ref name="gfsigepa"/> || 350 || 2016 || 200 || – || Planar || – || – || – |- | SiGe 1KW5PAe<ref name="gfsigepa"/> || 350 || ? || 200 || – || Planar || – || – || – |- | SiGe 1K5PAx<ref name="gfsigepa"/> || 350 || 2016 || 200 || – || Planar || – || – || – |- | 6S || 290|| 1996 || 200 Bulk || – || Planar || – || – || – |- | CS-44 || 250 || 1998 || 200 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 6S2 || 250 || 1997 || 200 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 6SF || 250 || ? || 200 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 6X || 250 || 1997 || 200 Bulk || – || Planar || – || – || – |- | 6RF || 250 || 2001 || 200 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 250SOI || 250 || 1999 || 200 SOI || Dry 248nm DUV || Planar || – || – || – |- | SiGe 6HP<ref>{{Cite web |title=BiCMOS 6HP Technology |url=http://www-3.ibm.com/chips/techlib/techlib.nsf/products/BiCMOS_6HP |url-status=dead |archive-url=https://web.archive.org/web/20160304000000/http://www-3.ibm.com/chips/techlib/techlib.nsf/products/BiCMOS_6HP |archive-date=2016-03-04 |website=IBM Microelectronics |publisher=IBM |language=EN}}</ref> || 250 || 2000 || 200 || Dry 248nm DUV || Planar || – || – || – |- | SiGe 6DM || 250 || ? || 200 || Dry 248nm DUV || Planar || – || – || – |- | SiGe 6WL || 250 || 2007 || 200 || Dry 248nm DUV || Planar || – || – || – |- | 7S || 220|| 1998 || 200 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 220SOI || 220|| 1999 || 200 SOI || Dry 248nm DUV || Planar || – || – || – |- | 7HV || 180 || 2010 || 200 || Dry 248nm DUV || Planar || – || – || – |- | 180 BCDLite<ref name="gf180nm">GlobalFoundries 130/180nm "[https://www.globalfoundries.com/technology-solutions/cmos/mainstream/130-180nm] {{Webarchive|url=https://web.archive.org/web/20200104171142/https://www.globalfoundries.com/technology-solutions/cmos/mainstream/130-180nm|date=2020-01-04}}". Retrieved December 27, 2019.</ref>|| 180 || 2011 || 200 || Dry 248nm DUV || Planar || – || – || – |- | 180 UHV<ref name="gf180nm"/> || 180 || 2017 || 200 || Dry 248nm DUV || Planar || – || – || – |- | 7SF || 180 || 1999 || 200 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 7TG || 180 || ? || 200 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 7RF || 180 || 2003 || 200 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 8S || 180 || 2000 || 200 SOI || Dry 248nm DUV || Planar || – || – || – |- | 7RF SOI<ref name="gfrfsoi">GlobalFoundries RF SOI Technologies "[https://www.globalfoundries.com/technologies/rf-soi-and-sige-technologies/rf-soi-technologies] {{Webarchive|url=https://web.archive.org/web/20191006044326/http://globalfoundries.com/technologies/rf-soi-and-sige-technologies/rf-soi-technologies|date=2019-10-06}}". Retrieved December 27, 2019.</ref>|| 180 || 2007 || 200 RF-SOI, 300 RF-SOI || Dry 248nm DUV || Planar || – || – || – |- | 7SW RF SOI<ref name="gfrfsoi"/> || 180 || 2014 || 200 RF-SOI || Dry 248nm DUV || Planar || – || – || – |- | SiGe 7WL<ref name="gfsigehp">GlobalFoundries SiGe HP Technologies "[https://www.globalfoundries.com/technologies/rf-soi-and-sige-technologies/sige-hp-technologies] {{Webarchive|url=https://web.archive.org/web/20201030050149/https://www.globalfoundries.com/technologies/rf-soi-and-sige-technologies/sige-hp-technologies|date=2020-10-30}}". Retrieved October 26, 2020.</ref>|| 180 || 2003 || 200 || Dry 248nm DUV || Planar || – || – || – |- | SiGe 7HP || 180 || 2003 || 200 || Dry 248nm DUV || Planar || – || – || – |- | 130 BCDLite<ref name="gf180nm"/> || 130 || 2014 || 300 || Dry 248nm DUV || Planar || – || – || – |- | 130 BCD<ref name="gf180nm"/> || 130 || ? || 300 || Dry 248nm DUV || Planar || – || – || – |- | 8SF || 130 || 2000 || 200 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 8SFG || 130 || 2003 || 200 Bulk, 300 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 8RF || 130 || 2003 || 200 Bulk, 300 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 130G<ref name="gf130nm">GlobalFoundries 130G/LP/EE "[https://www.globalfoundries.com/sites/default/files/product-briefs/pb-130glpee.pdf] {{Webarchive|url=https://web.archive.org/web/20210117101052/https://www.globalfoundries.com/sites/default/files/product-briefs/pb-130glpee.pdf|date=2021-01-17}}". Retrieved October 26, 2020.</ref>|| 130 || ? || 300 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 130LP<ref name="gf130nm"/> || 130 || ? || 300 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 130LP/EE<ref name="gf130nm"/> || 130 || ? || 300 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 110TS<ref name="gf130nm"/> || 130 || ? || 300 Bulk || Dry 248nm DUV || Planar || – || – || – |- | 9S || 130 || 2000 || 200 SOI, 300 SOI || Dry 248nm DUV || Planar || – || – || – |- | 130RFSOI<ref name="gfrfsoi"/> || 130 || 2015 || 300 RF-SOI || Dry 248nm DUV || Planar || – || – || – |- | 8SW RF SOI<ref name="gfrfsoi"/> || 130 || 2017 || 300 RF-SOI || Dry 248nm DUV || Planar || – || – || – |- | SiGe 8WL<ref name="gfsigehp"/> || 130 || 2005 || 200 || Dry 248nm DUV || Planar || – || – || – |- | SiGe 8HP<ref name="gfsigehp"/> || 130 || 2005 || 200, 300 || Dry 248nm DUV || Planar || – || – || – |- | SiGe 8XP<ref name="gfsigehp"/> || 130 || 2016 || 200 || Dry 248nm DUV || Planar || – || – || – |- | 9SF || 90 || 2004 || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 9LP || 90 || 2005 || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 9RF || 90 || ? || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 10S || 90 || 2002 || 300 SOI || Dry 193nm DUV || Planar || – || – || – |- | 90RFSOI || 90 || 2004 || 300 RF-SOI || Dry 193nm DUV || Planar || – || – || – |- | 9SW<ref name="9SW">{{Cite web|url=https://gf.com/gf-press-release/globalfoundries-announces-9sw-rfsoi-technology-for-next-generation-mobile-and-5g-applications/|title=GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications|first=Eric|last=Millington|date=August 29, 2023|website=GlobalFoundries}}</ref> || 90 || 2023 || 300 RF-SOI || Dry 193nm DUV || Planar || – || – || – |- | 90WG<ref name="gfsiph">GlobalFoundries Silicon Photonics "[https://www.globalfoundries.com/technology-solutions/silicon-photonics] {{Webarchive|url=https://web.archive.org/web/20201029093016/https://www.globalfoundries.com/technology-solutions/silicon-photonics|date=2020-10-29}}". Retrieved October 26, 2020.</ref>|| 90 || 2018 || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 90WG+<ref name="gfsiph"/> || 90 || ? || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | SiGe 9HP<ref name="gfsigehp"/> || 90 || 2014, 2018 || 200, 300 || Dry 193nm DUV || Planar || – || – || – |- | 10SF || 65 || ? || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 10LP || 65 || ? || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 65LPe<ref name="gf65nm">GlobalFoundries 55/65nm "[https://www.globalfoundries.com/technology-solutions/cmos/mainstream/55-65nm] {{Webarchive|url=https://web.archive.org/web/20191102075213/https://www.globalfoundries.com/technology-solutions/cmos/mainstream/55-65nm|date=2019-11-02}}". Retrieved December 27, 2019.</ref>|| 65 || 2009 || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 65LPe-RF<ref name="gf65nm"/> || 65 || 2009 || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 10RFe || 65 || ? || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 11S || 65 || 2006 || 300 SOI || Dry 193nm DUV || Planar || – || – || – |- | 65RFSOI || 65 || 2008 || 300 RF-SOI || Dry 193nm DUV || Planar || – || – || – |- | 55 BCDLite<ref name="gf65nm"/> || 55 || 2018 || 300 || Dry 193nm DUV || Planar || – || – || – |- | 55HV<ref name="gfddic">GlobalFoundries AMOLED Display Controllers "[https://www.globalfoundries.com/mobile-devices#displays] {{Webarchive|url=https://web.archive.org/web/20201025050523/https://www.globalfoundries.com/mobile-devices#displays|date=2020-10-25}}". Retrieved October 26, 2020.</ref>|| 55 || ? || 300 || Dry 193nm DUV || Planar || – || – || – |- | 55 ULP<ref name="gf65nm"/> || 55 || ? || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 55LPe || 55 || ? || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 55LPe-RF || 55 || ? || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 55LPx<ref name="gf65nm"/> || 55 || ? || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 55RF<ref name="gf65nm"/> || 55 || ? || 300 Bulk || Dry 193nm DUV || Planar || – || – || – |- | 45LP || 45 || ? || 300 Bulk || Wet 193nm DUV || Planar || – || – || – |- | 12S || 45 || 2007 || 300 SOI || Wet 193nm DUV || Planar || – || – || – |- | 45RFSOI<ref name="auto">{{Cite web |title=Technologies > ASICS > GlobalFoundries Technologies |url=https://europractice-ic.com/technologies/asics/globalfoundries/ |url-status=live |archive-url=https://web.archive.org/web/20231101000000/https://europractice-ic.com/technologies/asics/globalfoundries/ |archive-date=2023-11-01 |access-date=2025-11-20 |website=Europractice |publisher=Europractice IC Service |language=en}}</ref> || 45 || 2008 || 300 RF-SOI || Wet 193nm DUV || Planar || – || – || – |- | 45RFE<ref name="auto"/> || 45 || 2017 || 300 RF-SOI || Wet 193nm DUV || Planar || – || – || – |- | 45CLO<ref name="gfsiphrf">GlobalFoundries Silicon Photonics: A Marriage of Optical and Digital on GF’s RF Process "[https://www.globalfoundries.com/news-events/press-releases/silicon-photonics-marriage-optical-and-digital-gfs-rf-process] {{Webarchive|url=https://web.archive.org/web/20201029215041/https://www.globalfoundries.com/news-events/press-releases/silicon-photonics-marriage-optical-and-digital-gfs-rf-process|date=2020-10-29}}". Retrieved October 26, 2020.</ref>|| 45 || 2021 || 300 || Wet 193nm DUV || Planar || – || – || – |- | 40HV<ref name="gfddic"/> || 40 || ? || 300 || Wet 193nm DUV || Planar || – || – || – |- | 40LP<ref name="gf40nm">GlobalFoundries 40nm "[https://www.globalfoundries.com/technology-solutions/cmos/mainstream/40nm] {{Webarchive|url=https://web.archive.org/web/20191102084807/https://www.globalfoundries.com/technology-solutions/cmos/mainstream/40nm|date=2019-11-02}}". Retrieved December 27, 2019.</ref>|| 40 || ? || 300 Bulk || Wet 193nm DUV || Planar || – || – || – |- | 40LP-RF<ref name="gf40nm"/> || 40 || ? || 300 Bulk || Wet 193nm DUV || Planar || – || – || – |- | 13S || 32 || 2009 || 300 SOI || Wet 193nm DUV || Planar || – || – || – |- | 32LP || 32 || ? || 300 Bulk || Wet 193nm DUV || Planar || – || – || – |- | 32HP || 32 || ? || 300 SOI || Wet 193nm DUV, double patterning || Planar || – || – || – |- | 32SHP || 32 || 2010 || 300 SOI || Wet 193nm DUV, double patterning || Planar || – || – || – |- | 28HV<ref name="gfddic"/> || 28 || 2019 || 300 || Wet 193nm DUV || Planar || – || – || – |- | 28LP || 28 || 2009 || 300 Bulk || Wet 193nm DUV || Planar || – || – || – |- | 28SLP<ref name="gf28nm">GlobalFoundries 28nm HKMG Technologies "[https://www.globalfoundries.com/technology-solutions/cmos/fdx/28nm-hkmg-technologies] {{Webarchive|url=https://web.archive.org/web/20190330001520/https://www.globalfoundries.com/technology-solutions/cmos/fdx/28nm-hkmg-technologies|date=2019-03-30}}". Retrieved December 27, 2019.</ref>|| 28 || 2010 || 300 Bulk || Wet 193nm DUV || Planar || – || – || – |- | 28SLPe || 28 || 2011 || 300 Bulk || Wet 193nm DUV || Planar || – || – || – |- | 28HP || 28 || 2010 || 300 Bulk || Wet 193nm DUV, double patterning || Planar || – || – || – |- | 28HPP<ref name="gf28nm"/> || 28 || 2011 || 300 Bulk || Wet 193nm DUV, double patterning || Planar || – || – || – |- | 28SHP || 28 || 2013 || 300 Bulk || Wet 193nm DUV, double patterning || Planar || – || – || – |- | 28SLP RF || 28 || 2015 || 300 Bulk || Wet 193nm DUV || Planar || – || – || – |- | 28FDSOI<ref name="st22fdsoi" /><ref name="ss28fdsoi">Samsung and STMicroelectronics Sign Strategic Agreement to Expand 28nm FD-SOI Technology "[https://investors.st.com/news-releases/news-release-details/samsung-and-stmicroelectronics-sign-strategic-agreement-expand] {{Webarchive|url=https://web.archive.org/web/20201101021010/https://investors.st.com/news-releases/news-release-details/samsung-and-stmicroelectronics-sign-strategic-agreement-expand|date=2020-11-01}}". Retrieved October 26, 2020.</ref>|| 28 || 2012 || 300 FD-SOI || Wet 193nm DUV || Planar || – || – || – |- | 22FDX-ULP<ref name="gf22fdx">GlobalFoundries 22FDX "[https://www.globalfoundries.com/technology-solutions/cmos/fdx/22fdx] {{Webarchive|url=https://web.archive.org/web/20191226065432/https://www.globalfoundries.com/technology-solutions/cmos/fdx/22fdx|date=2019-12-26}}". Retrieved December 27, 2019.</ref>|| 22 || 2015 || 300 FD-SOI || Wet 193nm DUV || Planar || – || – || – |- | 22FDX-UHP<ref name="gf22fdx"/> || 22 || 2015 || 300 FD-SOI || Wet 193nm DUV || Planar || – || – || – |- | 22FDX-ULL<ref name="gf22fdx"/> || 22 || 2015 || 300 FD-SOI || Wet 193nm DUV || Planar || – || – || – |- | 22FDX-RFA<ref name="gf22fdx"/> || 22 || 2017 || 300 FD-SOI || Wet 193nm DUV || Planar || – || – || – |- | 22FDX RF+<ref name="gf22fdx+">GlobalFoundries Announces New 22FDX+ Platform "[https://www.globalfoundries.com/news-events/press-releases/globalfoundries-announces-new-22fdx-platform-extending-fdx-leadership] {{Webarchive|url=https://web.archive.org/web/20201007020153/https://www.globalfoundries.com/news-events/press-releases/globalfoundries-announces-new-22fdx-platform-extending-fdx-leadership|date=2020-10-07}}". Retrieved September 25, 2020.</ref>|| 22 || 2021 || 300 FD-SOI || Wet 193nm DUV || Planar || – || – || – |- | 14LPP<ref name="gf14lpp">GlobalFoundries 14LPP "[https://www.globalfoundries.com/sites/default/files/product-briefs/pb-14lpp.pdf] {{Webarchive|url=https://web.archive.org/web/20201029222258/https://www.globalfoundries.com/sites/default/files/product-briefs/pb-14lpp.pdf|date=2020-10-29}}". Retrieved October 26, 2020.</ref>|| 14 || 2015 || 300 Bulk || Wet 193nm DUV, double patterning || 3D (FinFET) || 78 || 64 || 0.09 |- | 14HP<ref name="gf14hp">GlobalFoundries Delivers Custom 14nm FinFET Technology for IBM Systems "[https://www.globalfoundries.com/news-events/press-releases/globalfoundries-delivers-custom-14nm-finfet-technology-for-ibm-systems] {{Webarchive|url=https://web.archive.org/web/20200114131353/https://www.globalfoundries.com/news-events/press-releases/globalfoundries-delivers-custom-14nm-finfet-technology-for-ibm-systems|date=2020-01-14}}". Retrieved January 14, 2020.</ref>|| 14 || 2017 || 300 SOI || Wet 193nm DUV, double patterning || 3D (FinFET) || – || – || – |- | 12LP<ref name="gf12lp">GlobalFoundries 12LP 12nm FinFET Technology "[https://www.globalfoundries.com/technology-solutions/cmos/performance/12lp] {{Webarchive|url=https://web.archive.org/web/20191129074417/https://www.globalfoundries.com/technology-solutions/cmos/performance/12lp|date=2019-11-29}}". Retrieved December 27, 2019.</ref>|| 12|| 2018 || 300 Bulk || Wet 193nm DUV, double patterning || 3D (FinFET) || – || – || – |- | 12LP+<ref name="gf12lp+">GlobalFoundries Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications "[https://www.globalfoundries.com/news-events/press-releases/globalfoundries-introduces-12lp-finfet-solution-cloud-and-edge-ai-0] {{Webarchive|url=https://web.archive.org/web/20201027101436/https://www.globalfoundries.com/news-events/press-releases/globalfoundries-introduces-12lp-finfet-solution-cloud-and-edge-ai-0|date=2020-10-27}}". Retrieved October 26, 2020.</ref>|| 12|| 2019 || 300 Bulk || Wet 193nm DUV, double patterning || 3D (FinFET) || – || – || – |}
Number of processes currently listed here: {{table row counter|id=gfprocs}}
==See also== * List of semiconductor fabrication plants
==References== {{Reflist}}
==External links== * {{Official website}} * {{commons category-inline}} {{Finance links | name = GlobalFoundries Inc. | symbol = GFS | reuters = GFS.O | bloomberg = GFS:US | sec_cik = 1709048 | yahoo = GFS | google = GFS:NASDAQ }}
{{coord|37.415293|-121.974448|region:US-CA_type:landmark|display=title}} {{Major semiconductor companies}} {{AMD}} {{IBM}}
{{Authority control|state=expanded}}
{{DEFAULTSORT:GlobalFoundries}} Category:GlobalFoundries Category:2009 establishments in California Category:American companies established in 2009 Category:Companies based in Saratoga County, New York Category:Companies listed on the Nasdaq Category:Semiconductor companies of the United States Category:Foundry semiconductor companies Category:Manufacturing companies based in New York (state) Category:Technology companies based in New York (state) Category:Electronics companies established in 2009 Category:Mubadala Investment Company Category:Corporate spin-offs Category:2021 initial public offerings Category:Offshore companies of the Cayman Islands Category:Computer companies of the United States Category:Computer hardware companies